Find UC Berkeley Faculty

Research Expertise and Interest

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Name

Department

Kameshwar Poolla

Kameshwar Poolla

Dept of Mechanical Engineering

Division of Electrical Engineering (EECS)

modeling, control, estimation, smart grids, renewable energy, electricity markets, transportation networks, integrated circuit design and manufacturing

Division of Electrical Engineering (EECS)

computer architecture, reconfigurable computing, wireless systems, integrated circuit and system design

Tsu-Jae Liu with multi-color background

Tsu-Jae Liu

Division of Electrical Engineering (EECS)

integrated-circuit devices and technology

Costas J. Spanos

Costas J. Spanos

Division of Electrical Engineering (EECS)

integrated circuits, solid-state devices, sensors, semiconductor manufacturing, energy efficiency, smart buildings

Division of Electrical Engineering (EECS)

sensor networks, integrated circuits, integrated wireless systems, low-power system design, biomedical interfaces

Alberto Sangiovanni-Vincentelli sitting with hand extended in front of diagram.

Alberto Sangiovanni-Vincentelli

Division of Electrical Engineering (EECS)

Cyber-Physical Systems, System design, Electronic Design Systems, embedded system design, control, integrated circuits, theory, Machine learning applications to Energy Efficient Building and Health

Sophia Shao

Division of Electrical Engineering (EECS)

computer architecture & engineering, integrated circuits

Pierluigi Nuzzo

Division of Computer Science (EECS)

Division of Electrical Engineering (EECS)

cyber-physical systems and design automation, control and intelligent systems and robotics, integrated circuits, computer architecture & engineering, artificial intelligence, power and energy, programming systems, security

Borivoje Nikolic

Borivoje Nikolic

Division of Electrical Engineering (EECS)

digital integrated circuits, VLSI implementation of communications, signal processing systems

Rikky Muller standing in front of graphic of the brain

Division of Electrical Engineering (EECS)

integrated circuits, biosystems and computational biology, micro/nano electro mechanical systems

Vladimir Stojanovic

Vladimir Stojanovic

Division of Electrical Engineering (EECS)

integrated circuits, silicon photonics, high-speed links, mixed-signal circuits, VLSI, emerging device technologies

Hayden Taylor (third from left) with group members and collaborators holding components produced by computed axial lithography

Dept of Mechanical Engineering

manufacturing, microfabrication, nanofabrication, semiconductor manufacturing, computational mechanics, nanoimprint lithography

Mengjie Yu

Division of Electrical Engineering (EECS)

physical electronics, artificial intelligence, integrated circuits, micro/nano electro mechanical systems

Simon Schleicher

Simon Schleicher

Dept of Architecture

biomimetics, structural engineering, architectural design, 3D printing, 3D scanning, digital fabrication, fabrication, composite structures, finite element analysis, parametric design, bio-inspired structures, robotics manufacturing, robotics

Alice M. Agogino

Alice M. Agogino

Dept of Mechanical Engineering

intelligent learning systems, information retrieval and data mining, multiobjective and strategic product design, nonlinear optimization, probabilistic modeling, intelligent control and manufacturing, sensor validation and fusion and diagnostics, wireless sensor networks, multimedia and computer-aided design, design databases, design theory and methods, MEMS Synthesis and CAD, artificial intelligence and decision and expert systems, gender equity

The Hydra mm-Wave (140 GHz) Testbed

Division of Electrical Engineering (EECS)

analog integrated circuits, RF microwave circuits, biomedical CMOS sensors, communication systems, scientific computing, applied electromagnetics, mm-waves, THz, radar, mm-wave and microwave imaging

Thomas M. Devine

Dept of Materials Science and Engineering

corrosion resistance of materials, additive manufacturing of metals

Renee in dean's office

Dept of Architecture

urban design, architectural design

Liwei Lin in lab

Liwei Lin

Dept of Mechanical Engineering

nanotechnology, MEMS (microelectromechanical systems), NEMS (nanoelectromechanical systems), design and manufacturing of microsensors, microactuators, development of micromachining processes, silicon surface/bulk micromachining, micromolding process

Zaijun Chen

Division of Electrical Engineering (EECS)

physical electronics, artificial intelligence, computer architecture & engineering, information / data / network / communication science, integrated circuits

Division of Electrical Engineering (EECS)

electrical engineering, computer sciences, integrated circuits, sensors, micro electromechanical systems, signal processors, frequency control, RF communications, micromachining technology

Ming Wu

Division of Electrical Engineering (EECS)

silicon photonics, MEMS, photonic integrated circuits, data center networks, 3D sensing, solid state LiDAR, optofluidics

head shot of Grigory Tikhomirov

Grigory Tikhomirov

Division of Computer Science (EECS)

bioengineering, nanofabrication, nanorobotics, biosystems and computational biology, energy, integrated circuits, micro/nano electro mechanical systems, physical electronics

Maria Paz Gutierrez

Maria Paz Gutierrez

Dept of Architecture

natural waste composites and additive manufacturing, flood resilience, multifunctional building systems, biologically inspired technologies, robotics and additive manufacturing