My research interests are in the area of PLASMA-ASSISTED MATERIALS PROCESSING AND PROCESSING DISCHARGES: How do you dig a trench 2000 atoms wide and 20,000 atoms deep in a silicon wafer? How do you dope the trench or fill it with metal? Chemically reactive plasma discharges are the essential tools to do these. Students in my group do experiments, computer simulations and theory, and develop models for both processing and processing discharges.
Research Expertise and Interest
plasma-assisted materials processing, processing discharges